Automates chuck cleaning inside the chamber via down-lot processing.
Replaces time-consuming and inefficient manual cleaning with cleanroom wipes.
Compatible with high-temp processes across all four major semiconductor stages.
Proven track record: AMAT, ASML, Nikon, Hitachi, Mattson.
Authorized agent for ITS (International Test Solutions), USA.
Cleans the chuck via "Swing out stage" without requiring equipment downtime.
Resolves Defocus and Hotspot issues occurring on the tool.
Eliminates the need for time-consuming and labor-intensive manual chamber opening.
Available in sizes ranging from 4-inch to 12-inch wafers.
Advantages
Reduced Maintenance Time:
Minimizes downtime for chamber opening and chuck cleaning, lowering labor costs while boosting equipment utilization.
Improved Production Flow:
Enhances throughput and smoothness during mass production runs.
Custom Application Development:
Provides tailored application support for various industrial sectors.
Versatile Specifications:
Offers a wide range of viscosity and thickness options to achieve optimal efficiency for different processes and tool conditions.
Replaces time-consuming and inefficient manual cleaning with cleanroom wipes.
Compatible with high-temp processes across all four major semiconductor stages.
Proven track record: AMAT, ASML, Nikon, Hitachi, Mattson.
Authorized agent for ITS (International Test Solutions), USA.
Cleans the chuck via "Swing out stage" without requiring equipment downtime.
Resolves Defocus and Hotspot issues occurring on the tool.
Eliminates the need for time-consuming and labor-intensive manual chamber opening.
Available in sizes ranging from 4-inch to 12-inch wafers.
Advantages
Reduced Maintenance Time:
Minimizes downtime for chamber opening and chuck cleaning, lowering labor costs while boosting equipment utilization.
Improved Production Flow:
Enhances throughput and smoothness during mass production runs.
Custom Application Development:
Provides tailored application support for various industrial sectors.
Versatile Specifications:
Offers a wide range of viscosity and thickness options to achieve optimal efficiency for different processes and tool conditions.