Product Features
•Composed of 2 to 12-inch wafers integrated with thermocouples.
•Accurately measures equipment stage/platform temperature.
•Multi-point measurement (1–34 points) for evaluating temperature uniformity.
•Heating ramp rate up to 35°C/s.
•Temperature range: -200°C to 1250°C.
•Highly customizable to meet specific requirements.
•Data can be transmitted to PC via wired or wireless loggers.
Certification & Calibration
•ILAC / ANAB Accredited Calibration Services.
•ISO 17025 accredited laboratory.
•Global calibration network and solutions to streamline your workflow.
Customized Temperature Measurement Tools for Quality Assurance
Our professional development team leverages extensive process experience to design and manufacture validated measurement tools.
Our self-developed Thermocouple Wafers (TCW) are calibrated by ILAC-authorized third-party laboratories following TAF/ANAB standards.
By capturing precise temperature data from single or multiple points on the wafer surface, users can calibrate process equipment and monitor environmental temperature uniformity.
Key Applications:
RTP, OVEN, REFLOW, HOT PLATE, CVD, PVD, SPUTTERING, and other semiconductor processes.
Our professional development team leverages extensive process experience to design and manufacture validated measurement tools.
Our self-developed Thermocouple Wafers (TCW) are calibrated by ILAC-authorized third-party laboratories following TAF/ANAB standards.
By capturing precise temperature data from single or multiple points on the wafer surface, users can calibrate process equipment and monitor environmental temperature uniformity.
Key Applications:
RTP, OVEN, REFLOW, HOT PLATE, CVD, PVD, SPUTTERING, and other semiconductor processes.
